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  4. Power Analysis Resilient SRAM Design Implemented with a 1% Area Overhead Impedance Randomization Unit for Security Applications
 
conference paper

Power Analysis Resilient SRAM Design Implemented with a 1% Area Overhead Impedance Randomization Unit for Security Applications

Giterman, Robert  
•
Wicentowski, Maoz
•
Chertkow, Oron
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January 1, 2019
Ieee 45Th European Solid State Circuits Conference (Esscirc 2019)
IEEE 45th European Solid State Circuits Conference (ESSCIRC)

Power analysis attacks are an effective tool to extract sensitive information using side-channel analysis, forming a serious threat to IoT systems-on-a-chip (SoCs). Embedded memories implemented with conventional 6T SRAM macrocells often dominate the area and power of these SoCs. In this paper, for the first time, we use silicon measurements to prove that conventional SRAM arrays leak valuable information and that their data can be extracted using power analysis attacks. In order to provide a power analysis resilient embedded memory and adhere to the area constraints of modern SoCs, we implement a low-cost impedance randomization unit, which is integrated into the periphery of a conventional 6T SRAM macro. Preliminary silicon measurements of a 55 nm test-chip implementing the proposed memory array demonstrate a significant information leakage reduction at a low-cost 1% area overhead and no speed and power penalties compared to a conventional SRAM design.

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Type
conference paper
DOI
10.1109/ESSCIRC.2019.8902622
Web of Science ID

WOS:000520410000014

Author(s)
Giterman, Robert  
Wicentowski, Maoz
Chertkow, Oron
Sever, Ilan
Kehati, Ishai
Weizman, Yoav
Keren, Osnat
Fish, Alexander
Date Issued

2019-01-01

Publisher

IEEE

Publisher place

New York

Published in
Ieee 45Th European Solid State Circuits Conference (Esscirc 2019)
ISBN of the book

978-1-7281-1550-4

Series title/Series vol.

Proceedings of the European Solid-State Circuits Conference

Start page

69

End page

72

Subjects

Engineering, Electrical & Electronic

•

Engineering

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
TCL  
Event nameEvent placeEvent date
IEEE 45th European Solid State Circuits Conference (ESSCIRC)

Cracow, POLAND

Sep 23-26, 2019

Available on Infoscience
April 8, 2020
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/168030
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