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  4. Metal to Glass Anodic Bonding for Microsystems Packaging
 
conference paper

Metal to Glass Anodic Bonding for Microsystems Packaging

Briand, D.  
•
Weber, P.
•
de Rooij, N. F.  
2003
Transducers03
  • Details
  • Metrics
Type
conference paper
DOI
10.1109/SENSOR.2003.1217142
Author(s)
Briand, D.  
Weber, P.
de Rooij, N. F.  
Date Issued

2003

Published in
Transducers03
Volume

2

Start page

1824

End page

1827

Editorial or Peer reviewed

NON-REVIEWED

Written at

OTHER

EPFL units
SAMLAB  
Available on Infoscience
May 12, 2009
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/39092
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