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RF-TSVs compatible with harsh-environment post-processing for “via-first” 3D integration
conference paper
RF-TSVs compatible with harsh-environment post-processing for “via-first” 3D integration
Gueye, R.
•
Wee, S. W.
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Vitale, W. A.
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2013
Proceedings of Transducers 2013
Transducers 2013
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