conference paper
RF-TSVs compatible with harsh-environment post-processing for “via-first” 3D integration
2013
Proceedings of Transducers 2013
Type
conference paper
Author(s)
Gueye, R.
Wee, S. W.
Vitale, W. A.
Truax, S.
Roman, C.
Ionescu, A.
Hierold, C.
Date Issued
2013
Published in
Proceedings of Transducers 2013
Volume
1
Start page
830
End page
833
Editorial or Peer reviewed
NON-REVIEWED
Written at
EPFL
EPFL units
| Event name | Event place | Event date |
Barcelona, Spain | June 17-20, 2013 | |
Available on Infoscience
April 23, 2014
Use this identifier to reference this record