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  4. 3-D structuration of LTCC for Sensor Micro-fluidic Applications
 
conference paper

3-D structuration of LTCC for Sensor Micro-fluidic Applications

Birol, Hansu  
•
Maeder, Thomas  
•
Jacq, Caroline  
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2004
European Microelectronics and Packaging Symposium - IMAPS
European Microelectronics and Packaging Symposium

Low Temperature Co-fired Ceramic (LTCC) Technology is recentlyaddressed to be a key approach among advanced packaging technologies, offering many advantages over its competitors. One of its most attractivefeatures is the ease of 3-D structuration thanks to the LTCC green tapes. These tapes can be easily cut into desired forms in the way to realize bothstructural and electrical functions under a single system. Three dimensional structures such as membranes, channels can be achieved either by cuttingand laminating LTCC tapes or by using a sacrificial layer. In this work, we demonstrate fabrication of an LTCC micro-fluidic sensor using carbon-paste as the sacrificial layer. The results indicate extremely fine-sized structural dimensions without deformation, which are attractive for pressureor thermal sensor applications.

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Birol_2004-EMPS Prague_3-D STRUCTURATION OF LTCC FOR SENSOR MICRO-FLUIDIC.pdf

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