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  4. 3-D structuration of LTCC for Sensor Micro-fluidic Applications
 
conference paper

3-D structuration of LTCC for Sensor Micro-fluidic Applications

Birol, Hansu  
•
Maeder, Thomas  
•
Jacq, Caroline  
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2004
European Microelectronics and Packaging Symposium - IMAPS
European Microelectronics and Packaging Symposium

Low Temperature Co-fired Ceramic (LTCC) Technology is recentlyaddressed to be a key approach among advanced packaging technologies, offering many advantages over its competitors. One of its most attractivefeatures is the ease of 3-D structuration thanks to the LTCC green tapes. These tapes can be easily cut into desired forms in the way to realize bothstructural and electrical functions under a single system. Three dimensional structures such as membranes, channels can be achieved either by cuttingand laminating LTCC tapes or by using a sacrificial layer. In this work, we demonstrate fabrication of an LTCC micro-fluidic sensor using carbon-paste as the sacrificial layer. The results indicate extremely fine-sized structural dimensions without deformation, which are attractive for pressureor thermal sensor applications.

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Type
conference paper
Author(s)
Birol, Hansu  
Maeder, Thomas  
Jacq, Caroline  
Ryser, Peter  
Date Issued

2004

Published in
European Microelectronics and Packaging Symposium - IMAPS
Start page

366

End page

371

Subjects

technologie des couches epaisses

•

thick-film technology

•

technologie hybride

•

films couches épaisses

•

LTCC

•

structuration 3D

•

couche sacrificielle carbone

•

membranes

•

canaux

•

capteurs pression

•

Wobbe

•

hot spot

Note

Structuration du LTCC en 3D, en utilisant une couche sacrificielle de carbone qui brûle à la cuisson du LTCC. On peut réaliser des membranes et des canaux de façon très fiable, sans les problèmes aux bords observés avec une couche intermédiaire découpée.

Editorial or Peer reviewed

NON-REVIEWED

Written at

EPFL

EPFL units
LPM  
Event nameEvent place
European Microelectronics and Packaging Symposium

Prague (CZ)

Available on Infoscience
June 22, 2006
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/232024
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