Notice détaillée
Titre
Sun, Fengda
Sciper ID
176857
Publications
Design and Feasibility of Multi-Gb/s Quasi-Serial Vertical Interconnects based on TSVs for 3D ICs
Emerging Interconnect Technologies
Surface-Tension-Driven Multi-Chip Self-Alignment Techniques for Heterogeneous 3D Integration
Emerging Interconnect Technologies
Surface-Tension-Driven Multi-Chip Self-Alignment Techniques for Heterogeneous 3D Integration
Toutes les ressources
Toutes les ressources
Le document apparaît dans
Authorities > People