Details
Title
Sun, Fengda
Sciper ID
176857
Publications
Design and Feasibility of Multi-Gb/s Quasi-Serial Vertical Interconnects based on TSVs for 3D ICs
Emerging Interconnect Technologies
Surface-Tension-Driven Multi-Chip Self-Alignment Techniques for Heterogeneous 3D Integration
Emerging Interconnect Technologies
Surface-Tension-Driven Multi-Chip Self-Alignment Techniques for Heterogeneous 3D Integration
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