conference paper
Numerical analysis of temperature elevation in the head due to power dissipation in a cortical implant
2008
Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
Type
conference paper
Web of Science ID
WOS:000262404500239
Author(s)
Date Issued
2008
Published in
Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
Start page
951
End page
956
Editorial or Peer reviewed
REVIEWED
Written at
EPFL
EPFL units
Available on Infoscience
May 21, 2010
Use this identifier to reference this record