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  4. Numerical analysis of temperature elevation in the head due to power dissipation in a cortical implant
 
conference paper

Numerical analysis of temperature elevation in the head due to power dissipation in a cortical implant

Silay, K. M.  
•
Dehollain, C.  
•
Declercq, M.  
2008
Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
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