conference paper
Top down meets bottom up: Nano-engineering for link between nm- and μm-scale
2002
Proceedings of 3rd Korea-Switzerland Joint Symposium in MEMS and Nano-technologies
Cite this item
Kim, G. M., Kim, B. J., Holleman, J., Huskens, J., ten Have, E., Kovalgin, A., Liebau, M., Reinhoudt, D. N., van Hulst, N. F., & Brugger, J. (2002). Top down meets bottom up: Nano-engineering for link between nm- and μm-scale. Proceedings of 3rd Korea-Switzerland Joint Symposium in MEMS and Nano-Technologies. 3rd Korea-Switzerland Joint Symposium in MEMS and Nano-technologies, Jeju, Korea, August 20 C.E. https://infoscience.epfl.ch/handle/20.500.14299/4640
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Type
conference paper
Author(s)
Kim, B J
Holleman, J
Huskens, J
ten Have, E
Kovalgin, A
Liebau, M
Reinhoudt, D N
van Hulst, N F
Date Issued
2002
Published in
Proceedings of 3rd Korea-Switzerland Joint Symposium in MEMS and Nano-technologies
Editorial or Peer reviewed
NON-REVIEWED
Written at
EPFL
EPFL units
| Event name | Event place | Event date |
Jeju, Korea | 19-20 June, 2002 | |
Available on Infoscience
April 13, 2007
Use this identifier to reference this record