A 16-kB 65-nm GC-eDRAM Macro With Internal Bias Voltage Generation Providing Over 100-μs Retention Time
Gain-cell embedded dynamic random access memory (GC-eDRAM) has emerged as a suitable choice for embedded memory implementation due to its high density, low leakage current, and voltage scaling compatibility. This work presents a 16-kB 3T-1C GC-eDRAM macro, featuring an innovative internal reference voltage generation mechanism and an on-chip dc-dc converter for internal boosted supply generation. The memory architecture is partitioned to efficiently accommodate the reference generation and implement a variation-tolerant sensing scheme. The on-chip dc-dc converter is employed for internally generating a boosted voltage that enhances charge retention to increase the data retention time (DRT). The memory macro was implemented in a 65-nm CMOS technology and fabricated as part of a research test chip. Measurements across a spectrum of boosted voltages and different temperature points, show a significant improvement in DRT compared with similar GC-eDRAM designs, without compromising area, performance, or power dissipation.
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Harel, O., Yigit, A., Feifel, E., Giterman, R., Burg, A., & Teman, A. (2024). A 16-kB 65-nm GC-eDRAM Macro With Internal Bias Voltage Generation Providing Over 100-μs Retention Time. IEEE Journal of Solid-State Circuits. https://doi.org/10.1109/JSSC.2024.3489793
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2-s2.0-85210289563
Bar-Ilan University
École Polytechnique Fédérale de Lausanne
Bar-Ilan University
Raaam Memory Technologies Ltd
École Polytechnique Fédérale de Lausanne
Bar-Ilan University
2024
REVIEWED
EPFL