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conference paper

Ceramic microcomponents by microstereolithography

Bertsch, Arnaud  
•
Jiguet, Sébastien  
•
Hofmann, H.  
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2004
17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest
17th IEEE International Conference on Micro Electro Mechanical Systems

This paper describes new polymer/ceramic photosensitive resins that can be used in the microstereolithography process for manufacturing complex 3D components in composite material. These new resins contain high loads (up to 80 wt.%) of alumina nanoparticles, used as fillers in a photosensitive acrylate-based resin of low viscosity. With the nanopowder-filled resin we developed, various small polymer/alumina composite components having a real geometric complexity were produced with small manufacturing times. When using a reactive medium containing a high enough percentage of ceramic nanoparticles, no deformation or cracks are observed after debinding and sintering, even if some shrinkage occurs during these steps. This process makes it possible to manufacture a new set of micro-components in ceramic material that could be of interest for high-temperature micro-reaction technologies, or for the production of new components in the biomedical domain.

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Type
conference paper
DOI
10.1109/MEMS.2004.1290687
Web of Science ID

WOS:000189435200180

Author(s)
Bertsch, Arnaud  
Jiguet, Sébastien  
Hofmann, H.  
Renaud, Philippe  
Date Issued

2004

Published in
17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest
Start page

725

End page

728

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LMIS4  
Event nameEvent placeEvent date
17th IEEE International Conference on Micro Electro Mechanical Systems

Maastricht, NETHERLANDS

JAN 25-29, 2004

Available on Infoscience
September 13, 2005
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/216205
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