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  4. Method and Device for Implementing Laser Shock Peening or Warm Laser Shock Peening During Selective Laser Melting
 
patent

Method and Device for Implementing Laser Shock Peening or Warm Laser Shock Peening During Selective Laser Melting

Kalentics, Nikola  
•
Logé, Roland  
•
Boillat, Eric  
2017

A method for manufacturing an object including the steps of forming layers by adding successive layers of material to form the object by selective laser melting (SLM), and inducing plastic deformation and residual stress into solidified material of at least one of the successive layers of material to improve mechanical properties and a fatigue resistance of the object, wherein the plastic deformation and the residual stress are induced by a laser.

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Type
patent
EPO Family ID

57018054

Author(s)
Kalentics, Nikola  
Logé, Roland  
Boillat, Eric  
Note

Alternative title(s) : (de) Verfahren und vorrichtung zur implementierung von laserschockstrahlen (lsp) oder warmem laserschockstrahlen (wlsp) beim selektiven laserschmelzen (slm) (fr) Procédé et dispositif d'application d'un martelage par choc laser (lsp) ou d'un martelage à chaud par choc laser (wlsp) lors de la fusion sélective par laser (slm) (en) Method and device for implementing laser shock peening (lsp) or warm laser shock peening (wlsp) during selective laser melting (slm)

TTO classification

TTO:6.1541

EPFL units
LMTM  
LGPP  
AVP-R-TTO  
IdentifierCountry codeKind codeDate issued

EP3147048

EP

B1

2020-08-05

US10596661

US

B2

2020-03-24

US2017087670

US

A1

2017-03-30

EP3147048

EP

A1

2017-03-29

Available on Infoscience
May 2, 2017
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/137002
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