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  4. Conductivity of SU-8 Thin Films through Atomic Force Microscopy Nano-Patterning
 
research article

Conductivity of SU-8 Thin Films through Atomic Force Microscopy Nano-Patterning

Martin-Olmos, Cristina
•
Villanueva, Guillermo  
•
van der Wal, Peter  
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2012
Advanced Functional Materials

Processing fl exibility and good mechanical properties are the two major reasons for SU-8 extensive applicability in the micro-fabrication of devices. In order to expand its usability down to the nanoscale, conductivity of ultra-thin SU-8 layers as well as its patterning by AFM are explored. By performing local electrical measurements outstanding insulating properties and a dielectric strength 100 times larger than that of SiO 2 are shown. It is also demonstrated that the resist can be nano-patterned using AFM, obtaining minimum dimensions below 40nm and that it can be combined with parallel lithographic methods like UV-lithography. The concurrence of excellent insulating properties and nanometer-scale patternability enables a valuable new approach for the fabrication of nanodevices. As a proof of principle, nano-electrode arrays for electrochemical measurements which show radial diffusion and no overlap between different diffusion layers are fabricated. This indicates the potential of the developed technique for the nanofabrication of devices.

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Type
research article
DOI
10.1002/adfm.201102789
Web of Science ID

WOS:000302346400017

Author(s)
Martin-Olmos, Cristina
Villanueva, Guillermo  
van der Wal, Peter  
Llobera, Andreu
de Rooij, Nico  
Brugger, Jürgen  
Perez-Murano, Francesco
Date Issued

2012

Publisher

Wiley-Blackwell

Published in
Advanced Functional Materials
Volume

22

Issue

7

Start page

1482

End page

1488

Subjects

Su-8

•

atomic force microscope (AFM)

•

scanning probe lithography (SPL)

•

dielectric properties

•

nano-electrode arrays

•

High-Aspect-Ratio

•

Electrostatic Nanolithography

•

Nanoelectrode Arrays

•

Olfactory Receptors

•

Uv-Photoresist

•

Lithography

•

Resolution

•

Polymers

•

Indentation

•

Ultrathick

Editorial or Peer reviewed

REVIEWED

Written at

OTHER

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Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/77366
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