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research article

Evaluation of thin film adhesion to compliant substrate by the analysis of progressive buckling in fragmentation test

Andersons, Janis
•
Tarasovs, S.
•
Leterrier, Yves  
2009
Thin Solid Films

The interface toughness of a thin coating/compliant substrate system is estimated based on the evolution of coating buckle patterns in the fragmentation test. The linear density of coating buckles as a function of applied strain is determined experimentally for a SiOx coating deposited on a polyethylene terephthalate film. A three-dimensional non-linear finite element model is developed to simulate the process of buckle formation in a single narrow coating strip. The elastic energy released during buckling-driven delamination is obtained from the energy balance in the system before and after the buckling event. Both the interface adhesion and the total energy release rate, which includes the plastic dissipation in the substrate during debonding, are evaluated. The apparent interfacial toughness, equal to 15 J/m2 at the onset of buckling, is found to increase with strain. This is tentatively explained by the probabilistic features of the buckle accumulation process, reflected also in the random locations of buckles evolving towards a log-normal distribution of buckle spacings at high strains.

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Type
research article
DOI
10.1016/j.tsf.2008.10.072
Web of Science ID

WOS:000263019900027

Author(s)
Andersons, Janis
Tarasovs, S.
Leterrier, Yves  
Date Issued

2009

Publisher

Elsevier

Published in
Thin Solid Films
Volume

517

Issue

6

Start page

2007

End page

2011

Subjects

Adhesion

•

Coatings

•

Interfaces

•

Silicon oxide

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LTC  
Available on Infoscience
January 13, 2009
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/33565
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