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review article

A 20-Year Retrospective on Power and Thermal Modeling and Management

Atienza, David  
•
Zhu, Kai  
•
Huang, Darong  
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August 7, 2025
IEEE Design & Test

As processor performance advances, increasing power densities and complex thermal behaviors threaten both energy efficiency and system reliability. This survey covers more than two decades of research on power and thermal modeling and management in modern processors. We start by comparing analytical, regression-based, and neural network-based techniques for power estimation, then review thermal modeling methods, including finite element, finite difference, and data-driven approaches. Next, we categorize dynamic runtime management strategies that balance performance, power consumption, and reliability. Finally, we conclude with a discussion of emerging challenges and promising research directions. Index Terms-multi-processor system-on-chip (MPSoC), power modeling, thermal modeling, power management, thermal management.

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Type
review article
Author(s)
Atienza, David  

EPFL

Zhu, Kai  

EPFL

Huang, Darong  

EPFL

Costero, Luis
Date Issued

2025-08-07

Published in
IEEE Design & Test
Subjects

multi-processor system-on-chip (MPSoC)

•

power modeling

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thermal modeling

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power management

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thermal management

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
ESL  
FunderFunding(s)Grant NumberGrant URL

Swiss State Secretariat for Education, Research, and Innovation (SERI)

SwissChips research project

Intel

Intel Center for Heterogeneous Integrated Platforms (HIP).

Grant PID2021-126576NBI00

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Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/252857
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