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research article

Intermediate temperature embrittlement of copper alloys

Laporte, Vincent  
•
Mortensen, Andreas  
2009
International Materials Reviews

Copper and its alloys generally display a severe reduction in ductility between roughly 300 and 600 degrees C, a phenomenon variously called 'intermediate temperature embrittlement' or 'ductility trough behaviour'. This review of the phenomenon begins by placing it in the wider context of the high-temperature fracture of metals, showing how its occurrence can be rationalised in simple terms on the basis of what is known of intergranular creep fracture and dynamic recrystallisation. Data in the literature are reviewed to identify main causes and mechanisms for embrittlement, first for pure copper, and then for monophase and multiphase copper alloys. Coverage then turns to the 'grain boundary embrittlement' phenomenon, caused by the intergranular segregation of even minute quantities of alloying additions or impurities, which appears to worsen dramatically the intermediate temperature embrittlement of copper alloys. Finally, metal-induced embrittlement, including in particular liquid metal embrittlement, is presented as a second mechanism leading to an exacerbation of the intermediate temperature embrittlement of copper and its alloys.

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Type
research article
DOI
10.1179/174328009X392967
Web of Science ID

WOS:000265755100002

Author(s)
Laporte, Vincent  
Mortensen, Andreas  
Date Issued

2009

Published in
International Materials Reviews
Volume

54

Issue

2

Start page

94

End page

116

Subjects

Copper

•

Ductility

•

Intergranular fracture

•

Grain boundary embrittlement

•

Liquid metal embrittlement

•

Metal-induced embrittlement

•

Grain-Boundary Segregation

•

Liquid-Metal Embrittlement

•

Strain-Rate Dependence

•

Beta-Phase Alloys

•

Percent-Zn Alloy

•

Auger-Electron Spectroscopy

•

Deformation Processing Map

•

Stacking-Fault Energy

•

Brittle Intergranular Fracture

•

Ray Photoelectron-Spectroscopy

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LMM  
Available on Infoscience
June 12, 2009
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/40422
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