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  4. Effect of filler behavior on nanocomposite SU8 photoresist for moving micro- parts
 
research article

Effect of filler behavior on nanocomposite SU8 photoresist for moving micro- parts

Jiguet, Sébastien  
•
Judelewicz, M.
•
Mischler, S.  
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2006
Microelectronic Engineering

The use of low-stress SU8 nanocomposites as a functional material for micro- parts and coating applications is described in this paper. It was found that the nanoparticles lower the internal stress and decrease the wear rate and frictional coefficient of the SU8 epoxy. The applicability of this technology is demonstrated on gear wheels configuration and coating multilayer capping technology on moving micro-parts

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Type
research article
DOI
10.1016/j.mee.2006.01.068
Web of Science ID

WOS:000237581900155

Author(s)
Jiguet, Sébastien  
Judelewicz, M.
Mischler, S.  
Bertsch, Arnaud  
Renaud, Philippe  
Date Issued

2006

Published in
Microelectronic Engineering
Volume

83

Start page

1273

End page

1276

Subjects

SU8

•

Stress

•

Nanocomposites

•

Photoresist

•

Wear

•

MEMS

•

Micro-parts

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LMIS4  
Available on Infoscience
October 20, 2006
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/235235
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