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  4. 4T Gain-Cell with internal-feedback for ultra-low retention power at scaled CMOS nodes
 
conference paper

4T Gain-Cell with internal-feedback for ultra-low retention power at scaled CMOS nodes

Giterman, Robert
•
Teman, Adam
•
Meinerzhagen, Pascal
Show more
2014
2014 IEEE International Symposium on Circuits and Systems (ISCAS)
2014 IEEE International Symposium on Circuits and Systems (ISCAS)

Gain-Cell embedded DRAM (GC-eDRAM) has recently been recognized as a possible alternative to traditional SRAM. While GC-eDRAM inherently provides high-density, low-leakage, low-voltage, and 2-ported operation, its limited retention time requires periodic, power-hungry refresh cycles. This drawback is further enhanced at scaled technologies, where increased subthreshold leakage currents and decreased in-cell storage capacitances result in faster data deterioration. In this paper, we present a novel 4T GC-eDRAM bitcell that utilizes an internal feedback mechanism to significantly increase the data retention time in scaled CMOS technologies. A 2 kb memory macro was implemented in a low-power 65nm CMOS technology, displaying an over 3× improvement in retention time over the best previous publication at this node. The resulting array displays a nearly 5× reduction in retention power (despite the refresh power component) with a 40% reduction in bitcell area, as compared to a standard 6T SRAM.

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Type
conference paper
DOI
10.1109/ISCAS.2014.6865600
Author(s)
Giterman, Robert
Teman, Adam
Meinerzhagen, Pascal
Burg, Andreas  
Fish, Alexander
Date Issued

2014

Publisher

IEEE

Published in
2014 IEEE International Symposium on Circuits and Systems (ISCAS)
Start page

2177

End page

2180

Subjects

CMOS memory circuits

•

DRAM chips

•

circuit feedback

•

leakage currents

•

low-power electronics

•

4T GC-eDRAM bitcell

•

4T gain-cell

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bitcell area reduction

•

decreased in-cell storage capacitances

•

gain-cell embedded DRAM

•

internal feedback mechanism

•

low-power CMOS technology

•

memory macro

•

periodic power-hungry refresh cycles

•

scaled CMOS nodes

•

size 65 nm

•

standard 6T SRAM

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storage capacity 2 Kbit

•

subthreshold leakage currents

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ultra-low retention power

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CMOS integrated circuits

•

Computer architecture

•

Leakage currents

•

Microprocessors

•

Random access memory

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
TCL  
Event nameEvent placeEvent date
2014 IEEE International Symposium on Circuits and Systems (ISCAS)

Melbourne VIC, Australia

1-5 June 2014

Available on Infoscience
November 12, 2014
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/108585
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