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research article

High-throughput scanning electrochemical microscopy brushing of strongly tilted and curved surfaces

Lesch, Andreas  
•
Momotenko, Dmitry  
•
Cortes Salazar, Fernando  
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2013
Electrochimica Acta

The feasibility of high-throughput scanning electrochemical microscopy (SECM) of strongly tilted (tilt angles ≤4°) and curved substrates (diameter of curvature ≥9 cm) is demonstrated by brushing them with a soft linear array of carbon microelectrodes. This probe made of thin polymeric layers operates in contact regime to follow the topography of highly unconventional SECM samples while keeping an almost constant working distance. Strong slope variations of the sample lead to a slight misalignment between the axes of the positioning system and the sliding direction of the microelectrode arrays. The resulting positional offsets can be predicted and corrected to yield a correct representation of the spatial relation on the surface of the sample. Moreover, a custom-made holder system ideally suited for precise control of the soft probe inclination angle and alignment with the substrate plane was also developed to perform high-throughput SECM imaging of a 1.2 cm2 curved metallic pin within less than 2 h.

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Type
research article
DOI
10.1016/j.electacta.2013.03.101
Web of Science ID

WOS:000329530300006

Author(s)
Lesch, Andreas  
Momotenko, Dmitry  
Cortes Salazar, Fernando  
Roelfs, Folkert
Girault, Hubert  
Wittstock, Gunther  
Date Issued

2013

Publisher

Elsevier

Published in
Electrochimica Acta
Volume

110

Start page

30

End page

41

Subjects

Soft linear microelectrode arrays

•

Scanning electrochemical microscopy

•

Contact mode scanning

•

Strongly tilted substrates

•

Strongly curved substrates

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

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March 12, 2013
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/90283
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