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  4. Advanced Sensor Systems by Low-Temperature Heterogeneous 3D Integration Processes
 
conference paper

Advanced Sensor Systems by Low-Temperature Heterogeneous 3D Integration Processes

Fernandez-Bolanos, Montserrat  
•
Muller, Andrei  
•
Weber, Josef
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January 1, 2018
2018 Symposium On Design, Test, Integration & Packaging Of Mems And Moems (Dtip)
20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP)

A few application demonstrators of heterogeneous 3D integrated systems including innovative nanosensors for gas detection and biofludic applications have been successfully implemented showing efficient low-temperature heterogeneous integration processes, miniaturization, low power consumption, extremely low detection limits (5 ppm) and novel functionalities very interesting for smart sensors in automotive and healthcare applications.

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