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  4. 3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs
 
research article

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Sridhar, Arvind  
•
Vincenzi, Alessandro  
•
Atienza Alonso, David  
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2014
IEEE Transactions on Computers

Liquid-cooling using microchannel heat sinks etched on silicon dies is seen as a promising solution to the rising heat fluxes in two-dimensional and stacked three-dimensional integrated circuits. Development of such devices requires accurate and fast thermal simulators suitable for early-stage design. To this end, we present 3D-ICE, a compact transient thermal model (CTTM), for liquid-cooled ICs. 3D-ICE was first advanced by incorporating the 4-resistor model based CTTM (4RM-based CTTM). It was enhanced to speed up simulations and to include complex heat sink geometries such as pin fins using the new 2 resistor model (2RM-based CTTM). In this paper, we extend the 3D-ICE model to include liquid-cooled ICs with multi-port cavities, i.e., cavities with more than one inlet and one outlet ports, and non-straight microchannels. Simulation studies using a realistic 3D multiprocessor system-on-chip (MPSoC) with a 4-port microchannel cavity highlight the impact of using 4-port cavity on temperature and also demonstrate the superior performance of 2RM-based CTTM compared to 4RM-based CTTM. We also present an extensive review of existing literature and the derivation of the 3D-ICE model, creating a comprehensive study of liquid-cooled ICs and their thermal simulation from the perspective of computer systems design. Finally, the accuracy of 3D-ICE has been evaluated against measurements from a real liquid-cooled 3D IC, which is the first such validation of a simulator of this genre. Results show strong agreement (average error<10%), demonstrating that 3D-ICE is an effective tool for early-stage thermal-aware design of liquid-cooled 2D/3D ICs.

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Type
research article
DOI
10.1109/TC.2013.127
Web of Science ID

WOS:000343886800016

Author(s)
Sridhar, Arvind  
Vincenzi, Alessandro  
Atienza Alonso, David  
Brunschwiler, Thomas
Date Issued

2014

Publisher

Institute of Electrical and Electronics Engineers

Published in
IEEE Transactions on Computers
Volume

63

Issue

10

Start page

2576

End page

2589

Subjects

liquid cooling

•

thermal modeling

•

3D

•

Integrated circuits

•

computer engineering

•

microchannel

•

resistor networks

•

compact modeling

•

thermal simulation

•

3D-ICE

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
ESL  
Available on Infoscience
May 29, 2013
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/92503
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