conference paper
Resistivity Measurements of Gold Wires Fabricated by Stencil Lithography on Flexible Polymer Substrates
2008
Microelectronic Engineering
We report on the patterning and characterization of titanium–gold (Ti–Au) wire test structures on polyethylene naphthalate (PEN), polyethylene terephthalate (PET) and polyimide (PI) substrates. PEN, PET and PI are flexible polymers which can withstand stress and strain. The used patterning method is stencil lithography, a resistless patterning method and based on the shadow mask technique. From the electrical characterization, the resistivity of the Ti–Au wires on the different flexible substrates was determined.
Type
conference paper
Web of Science ID
WOS:000257413400093
Date Issued
2008
Publisher
Published in
Microelectronic Engineering
Volume
85
Start page
1108
End page
1111
Editorial or Peer reviewed
REVIEWED
Written at
EPFL
| Event name | Event place | Event date |
Copenhagen, Denmark | 23-26 Sept, 2007 | |
Use this identifier to reference this record