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  4. Foil-to-foil interconnection of capacitive humidity sensors using electrically conductive adhesives
 
conference poster not in proceedings

Foil-to-foil interconnection of capacitive humidity sensors using electrically conductive adhesives

Quintero, Vasquez  
•
Felipe, Andres
•
van Remoortere, Bart
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2013
Micronarc Alpine Meeting (mAm) 2013

The present study presents the development and comparison of two foil-to-foil lamination and interconnection methods of foil-based capacitive humidity sensors. The first method uses confined anisotropic conductive adhesive (ICA) in laser ablated vias through foil (TFV). The second method uses anisotropic conductive adhesive (ACA). Both integration methods were characterized during accelerated humidity (85°C / 85 R.H.),shock temperature (-40°C / 125°C) and bending forces. While the ACA method requires less processing steps and the TFV method was shown to be more robust to bending forces, the interconnection of both methods withstood more than 900 hours of environmental ageing. Finally, the correct functionality of two types of foil-based capacitive humidity sensors was successfully demonstrated by exposing them to different R.H. levels and comparing their readings to a commercial sensor.

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Type
conference poster not in proceedings
Author(s)
Quintero, Vasquez  
Felipe, Andres
van Remoortere, Bart
Smits, Edsger C. P.
van den Brand, Jeroen  
Briand, Danick  
Schoob, Herman F. M.
de Rooij, Nico F.  
Date Issued

2013

Written at

EPFL

EPFL units
SAMLAB  
Event nameEvent placeEvent date
Micronarc Alpine Meeting (mAm) 2013

Villars-sur-Ollon, Switzerland

January 13-15, 2013

Available on Infoscience
January 25, 2013
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/88172
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