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  4. GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation
 
research article

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

Sabry, Mohamed M.
•
Sridhar, Arvind  
•
Meng, Jie
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2013
Ieee Transactions On Computer-Aided Design Of Integrated Circuits And Systems

Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel-based liquid cooling, however, can substantially increase the on-chip thermal gradients, which are undesirable for reliability, performance, and cooling efficiency. In this paper, we present GreenCool, an optimal design methodology for liquid-cooled 3-D MPSoCs. GreenCool simultaneously minimizes the cooling energy for a given system while maintaining thermal gradients and peak temperatures under safe limits. This is accomplished by tuning the heat transfer characteristics of the microchannels using channel width modulation. Channel width modulation is compatible with the current process technologies and incurs minimal additional fabrication costs. Through an extensive set of experiments, we show that channel width modulation is capable of complementing and enhancing the benefits of temperature-aware floorplanning. We also experiment with a 16-core 3-D system with stacked dynamic random-access memory, for which GreenCool improves energy efficiency by up to 53% with respect to no channel modulation.

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Type
research article
DOI
10.1109/Tcad.2012.2226032
Web of Science ID

WOS:000317001200005

Author(s)
Sabry, Mohamed M.
Sridhar, Arvind  
Meng, Jie
Coskun, Ayse K.
Atienza, David  
Date Issued

2013

Publisher

Institute of Electrical and Electronics Engineers

Published in
Ieee Transactions On Computer-Aided Design Of Integrated Circuits And Systems
Volume

32

Issue

4

Start page

524

End page

537

Subjects

3-D ICs

•

energy efficiency

•

liquid cooling

•

systems-on-chip

•

multi-processor

•

computer engineering

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
ESL  
Available on Infoscience
May 13, 2013
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/92137
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