A novel fabrication method based on the local sputtering of photoresist sidewalls during ion beam etching is presented. This method allows for the manufacture of three-dimensional multimaterial nanostructures at the wafer scale in only four process steps. Features of various shapes and profiles can be fabricated at sub-100-nm dimensions with unprecedented freedom in material choice. Complex nanostructures such as nanochannels, multimaterial nanowalls, and suspended networks were successfully fabricated using only standard microprocessing tools. This provides an alternative to traditional nanofabrication techniques, as well as new opportunities for biosensing, nanofluidics, nanophotonics, and nanoelectronics.