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  4. Electro-thermal virtual prototyping of a Rogowski Coil sensor system
 
conference paper

Electro-thermal virtual prototyping of a Rogowski Coil sensor system

Rodriguez Estupinan, Juan Sebastian
•
Vachoux, Alain  
•
Pascal, Joris
2015
2015 IEEE International Conference on Industrial Technology (ICIT)
2015 IEEE International Conference on Industrial Technology (ICIT)

An electro-thermal model of a Rogowski Coil sensor system is here described. A co-design methodology between VHDL-AMS and Finite Element Analysis (FEA) has been used for modeling the entire system. The proposed modeling strategy uses geometrical FEA to complete a time-dependent parametrical heat transfer model, which can be implemented in VHDL-AMS or in any other similar hardware description language. This is especially useful for performing simulations with the embedded signal processing electronics of the sensor. Important geometrical, environmental and inner material properties of the Rogowski Coil sensor system, which are difficult, or even impossible to simulate dynamically in a classical lumped-element model, are taken into account indirectly in the proposed model. This allows to study the cross-domain effects in the complete system.

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Type
conference paper
DOI
10.1109/ICIT.2015.7125301
Author(s)
Rodriguez Estupinan, Juan Sebastian
Vachoux, Alain  
Pascal, Joris
Date Issued

2015

Publisher

IEEE

Published in
2015 IEEE International Conference on Industrial Technology (ICIT)
Start page

1451

End page

1456

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LSM  
Event nameEvent placeEvent date
2015 IEEE International Conference on Industrial Technology (ICIT)

Seville, Spain

17-19 March 2015

Available on Infoscience
July 1, 2015
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/115485
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