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  4. Thermal and Voltage-Aware Performance Management of 3D MPSoCs with Flow Cell Arrays and Integrated SC Converters
 
research article

Thermal and Voltage-Aware Performance Management of 3D MPSoCs with Flow Cell Arrays and Integrated SC Converters

Najibi, Halima  
•
Levisse, Alexandre Sébastien Julien  
•
Ansaloni, Giovanni  
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2022
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)

Flow cell arrays (FCAs) concurrently provide efficient on-chip liquid cooling and electrochemical power generation. This technology is especially promising for three-dimensional multi-processor systems-on-chip (3D MPSoCs) realized in deeply scaled technologies, which present very challenging power and thermal requirements. Indeed, FCAs effectively improve power delivery network (PDN) performance, particularly if switched capacitor (SC) converters are employed to decouple the flow cells and the systems-on-chip voltages, allowing each to operate at their optimal point. Nonetheless, the design of FCA-based solutions entails non-obvious considerations and trade-offs, stemming from their dual role in governing both the thermal and power delivery characteristics of 3D MPSoCs. Showcasing them in this paper, we explore multiple FCA design configurations and demonstrate that this technology can decrease the temperature of a heterogeneous 3D MPSoC by 78°C, and its total power consumption by 46%, compared to a high-performance cold-plate based liquid cooling solution. At the same time, FCAs enable up to 90% voltage drop recovery across dies, using SC converters occupying a small fraction of the chip area. Such outcomes provide an opportunity to boost 3D MPSoC computing performance by increasing the operating frequency of dies. Leveraging these results, we introduce a novel temperature and voltage-aware model predictive control (MPC) strategy that optimizes power efficiency during run-time. We achieve application-wide speed-ups of up to 16% on various machine learning (ML), data mining, and other high-performance benchmarks while keeping the 3D MPSoC temperature below 83°C and voltage drops below 5%.

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Type
research article
DOI
10.1109/TCAD.2022.3168257
Author(s)
Najibi, Halima  
Levisse, Alexandre Sébastien Julien  
Ansaloni, Giovanni  
Zapater Sancho, Marina  
Vasic, Miroslav
Atienza Alonso, David  
Date Issued

2022

Published in
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)
Volume

1

Start page

2

End page

15

Subjects

3D MPSoC Management

•

Flow Cell Arrays

•

On-Chip Liquid Cooling

•

On-Chip Power Generation

•

Online Frequency Optimization

•

Model Predictive Control

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
ESL  
FunderGrant Number

H2020

863337

H2020

101016776

EU funding

725657

Available on Infoscience
April 13, 2022
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/187134
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