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research article
Intrinsic, thermal and hygroscopic residual stresses in thin gas-barrier films on polymer substrates
2007
Intrinsic, thermal, and hygroscopic contributions to the in-plane residual stress in silicon nitride films on polyimide substrates are identified, based on iso- hygric thermal ramps and isothermal relative humidity jumps, combined with non-linear elastic modeling of the resulting dynamics of film curvature. This approach enables the thermal and hygroscopic properties of thin nitride films to be determined and provides useful input for material and process control.
Type
research article
Authors
Publication date
2007
Published in
Volume
515
Issue
19
Start page
7437
End page
7441
Peer reviewed
REVIEWED
EPFL units
Available on Infoscience
January 23, 2007
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