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research article

Optimization of the fabrication of sealed capacitive transducers using surface micromachining

Belgacem, B.  
•
Alquier, D.
•
Muralt, P.  
Show more
2004
Journal of Micromechanics and Microengineering

Processing issues for the fabrication of capacitive micromachined ultrasonic transducer (cMUT) arrays have been studied using surface micromachining. This work focuses on the critical steps of process fabrication such as membrane formation, sacrificial layer properties and vacuum sealing performance of cavity. We describe a four-mask process for the realization of sealed cMUT. We demonstrate that the use of a sacrificial layer with a columnar structure gives a fast etching rate (29 nm s(-1)) in a buffered hydrofluoric acid solution. The mechanical stress of LPCVD silicon nitride (SiNx), used as membrane, was evaluated. We compared the vacuum sealing performance of different materials in order to find the best material in terms of lateral deposition inside the cavity. Functional transducers have been obtained. We proposed an electrical test in order to evaluate the vacuum sealing of the cavity based on the collapse voltage determination. Laser interference measurements were used to characterize the dynamic displacement of the membrane.

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Type
research article
DOI
10.1088/0960-1317/14/2/019
Web of Science ID

WOS:000220381600019

Author(s)
Belgacem, B.  
Alquier, D.
Muralt, P.  
Baborowski, J.  
Lucas, S.
Jerisian, R.
Date Issued

2004

Published in
Journal of Micromechanics and Microengineering
Volume

14

Issue

2

Start page

299

End page

304

Subjects

ultrasonic transducers

Note

Belgacem, B Lab LMP, 16,Rue Pierre & Marie Curie,BP 7155, F-37071 Tours 2, France Lab LMP, F-37071 Tours 2, France STMicroelect, F-37071 Tours, France Swiss Fed Inst Technol, Lab LC, EPFL, CH-1015 Lausanne, Switzerland

805QU

Cited References Count:21

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LC  
Available on Infoscience
August 21, 2006
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/233522
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