ELECTROSTATIC CLAMPING CHUCK FOR NANOSTENCILS

There is growing interest in using alternative, resistless patterning techniques. Stencil lithography or shadow masking is one of the possible solutions. By means of physical vapor deposition many different materials can be evaporated in vacuum and patterned through a mask onto a substrate. This can be done in static and dynamic mode. The LMIS1 group is currently developing stencils with improved characteristics as well as a setup that will allow dynamic stencil deposition. In such a setup, a nanostencil is mounted onto a xy-stage and is then moved relative to the substrate. The goal of this project is to develop a miniaturized electrostatic chuck that allows the clamping of nanostencils in a reliable and user-friendly manner.


Year:
2006
Laboratories:


Note: The status of this file is: EPFL only


 Record created 2006-03-20, last modified 2018-03-17

n/a:
Download fulltext
PDF

Rate this document:

Rate this document:
1
2
3
 
(Not yet reviewed)