Three-dimensional miniaturised power Inductors realised in a batch-type hybrid technology

We present a new hybrid technology for the realization of three-dimensional millimetre-size inductors for low-power (0.1–1 W) applications. Our devices consist of electroplated planar Cu coils, realized within a high-resolution (5 µm) polyimide flex-foil process, and mm-size ferrite magnetic cores, obtained by three-dimensional micropatterning of ferrite wafers using powder blasting microerosion. Our devices range in volume between 10 and 1.5 mm3 and we characterize their inductive and resistive properties as a function of frequency.


Published in:
Journal of Micromechanics and Microengineering, 12, 470-474
Year:
2002
Laboratories:




 Record created 2005-10-26, last modified 2018-03-17

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