Cubic millimeter power inductor fabricated in batch-type wafer technology

A hybrid technology for the realization of three-dimensional (3-D) miniaturized power inductors is presented. Our devices consist of planar Cu coils on polyimide substrates, and mm-size ferrite magnetic cores, obtained by three-dimensional micro-patterning of ferrite wafers using powder blasting. The coils are realized using an in-house developed high-resolution polyimide spinning and Cu electroplating process. Winding widths down to 5 um have been obtained and total device volumes are ranging between 1.5 and 10 mm3. Inductive and resistive properties are characterized as a function of frequency; inductance values in the 100 uH range have been obtained.


Published in:
J. Microelectromechanical Systems, 12, 2, 172-178
Year:
2003
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 Record created 2005-10-26, last modified 2018-03-17

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