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research article

Elimination of buried interfacial voids for efficient perovskite solar cells

Zeng, Li-Rong
•
Ding, Bin  
•
Zhang, Gao
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January 16, 2024
Nano Energy

Establishing optimal interfacial contact is crucial for enhancing the efficiency of perovskite solar cells (PSCs). However, formation of voids at buried interface of perovskite films often hinders this critical objective. Our investigation reveals that these buried interfacial voids predominantly manifest at sites characterized by largeangle pits on rough substrate, due to their elevated nucleation barriers compared to their small-angle counterparts. To address this challenge and promote uniform nucleation and growth across all sites, regardless of their angles, we develop an innovative precursor regulation strategy to reduce the nucleation barrier discrepancy between different sites by introducing nonstoichiometric homologous ions or by facilitating the formation of intermediate phases. Notably, the incorporation of FACl additive into the FAPbI3 precursor combines the dual benefits of this approach, yielding high-quality perovskite film with intimate contact and reduced defect density. Consequently, this leads to a significant enhancement in the photovoltaic performance of PSCs.

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Type
research article
DOI
10.1016/j.nanoen.2024.109283
Web of Science ID

WOS:001166424000001

Author(s)
Zeng, Li-Rong
Ding, Bin  
Zhang, Gao
Liu, Yan
Zhang, Xin
Yang, Guan-Jun
Chen, Bo
Date Issued

2024-01-16

Publisher

Elsevier

Published in
Nano Energy
Volume

122

Article Number

109283

Subjects

Physical Sciences

•

Technology

•

Buried Interfacial Voids

•

Rough Substrate

•

Nucleation Barrier

•

Precursor Regulation

•

Perovskite Solar Cells

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
GMF  
FunderGrant Number

National Key R & D Pro- gram of China

2019YFB1503200

National Natural Science Foundation of China

52273273

Available on Infoscience
March 18, 2024
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/206458
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