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  4. Modelling of vertical and ferroelectric junctionless technology for efficient 3D neural network compute cube dedicated to embedded artificial intelligence
 
conference paper

Modelling of vertical and ferroelectric junctionless technology for efficient 3D neural network compute cube dedicated to embedded artificial intelligence

Maneux, C
•
Mukherjee, C.
•
Deng, M.
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2021
2021 IEEE International Electron Devices Meeting (IEDM)
67th Annual IEEE International Electron Devices Meeting (IEDM 2021)

This paper presents the set of simulation means used to develop the concept of N2C2 (neural network compute cube) based on a vertical transistor technology platform. On the basis of state-of-the-art junctionless nanowire transistors (JLNT), TCAD simulation, compact modeling and EM simulation are leveraged through a Design- Technology Co-Optimization (DTCO) to achieve innovative 3D circuit architectures. Further, System-Technology Co-Optimization (STCO) implications on 3D NN system architecture are explored.

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IEDM_INVITED_MANEUX_2021 07 23 FINAL.pdf

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Postprint

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Accepted version

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openaccess

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copyright

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568.68 KB

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Adobe PDF

Checksum (MD5)

382adeec36631dee9af473e3bc7e10bd

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