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  4. TacTiles: Dual-Mode Low-Power Electromagnetic Actuators for Rendering Continuous Contact and Spatial Haptic Patterns in VR
 
conference paper

TacTiles: Dual-Mode Low-Power Electromagnetic Actuators for Rendering Continuous Contact and Spatial Haptic Patterns in VR

Vechev, Velko
•
Zarate, Juan
•
Lindlbauer, David
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January 1, 2019
2019 26Th Ieee Conference On Virtual Reality And 3D User Interfaces (Vr)
26th IEEE Conference on Virtual Reality and 3D User Interfaces (VR)

We introduce TacTiles, light (1.8g), low-power (130 mV), and small form -factor (1cm(3)) electromagnetic actuators that can form a flexible haptic array to provide localized tactile feedback. Our novel hardware design uses a custom 8 -layer PCB, dampening materials, and asymmetric latching, enabling two distinct modes of actuation: contact and pulse mode. We leverage these modes in Virtual Reality (VR) to render continuous contact with objects and the exploration of object surfaces and volumes with spatial haptic patterns. Results from a series of experiments show that users are able to localize feedback, discriminate between modes with high accuracy, and differentiate objects from haptic surfaces and volumes even without looking at them.

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Type
conference paper
DOI
10.1109/VR.2019.8797921
Web of Science ID

WOS:000521472600037

Author(s)
Vechev, Velko
Zarate, Juan
Lindlbauer, David
Hinchet, Ronan  
Shea, Herbert  
Hilliges, Otmar
Date Issued

2019-01-01

Publisher

IEEE

Publisher place

New York

Published in
2019 26Th Ieee Conference On Virtual Reality And 3D User Interfaces (Vr)
ISBN of the book

978-1-7281-1377-7

Start page

312

End page

320

Subjects

human-centered computing-human computer interaction (hci)-interaction devices-haptic devices

•

human-centered computing-human computer interaction (hci)-interaction paradigms-virtual reality

•

objects

•

touch

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LMTS  
Event nameEvent placeEvent date
26th IEEE Conference on Virtual Reality and 3D User Interfaces (VR)

Osaka, JAPAN

Mar 23-27, 2019

Available on Infoscience
May 16, 2020
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/168775
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