Details
Title
Temiz, Yüksel
Sciper ID
178130
Publications
3D Architecture and Replaceable Layers for Label-Free DNA Biochips
3D Integration Technology for Lab-on-a-Chip Applications
A Comparative Study on Fabrication Techniques for On-Chip Microelectrodes
Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology
Design and characterization of micromachined sensor array integrated with CMOS based optical readout
Integrating Bio-sensing Functions on CMOS Chips
Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography
Post-cmos processing and 3d integration based on dry-film lithography
Real-time high-sensitivity impedance measurement interface for tethered BLM biosensor arrays
Towards Thermally-Aware Design of 3D MPSoCs with Inter-Tier Cooling
See complete list of publications (18)
3D Integration Technology for Lab-on-a-Chip Applications
A Comparative Study on Fabrication Techniques for On-Chip Microelectrodes
Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology
Design and characterization of micromachined sensor array integrated with CMOS based optical readout
Integrating Bio-sensing Functions on CMOS Chips
Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography
Post-cmos processing and 3d integration based on dry-film lithography
Real-time high-sensitivity impedance measurement interface for tethered BLM biosensor arrays
Towards Thermally-Aware Design of 3D MPSoCs with Inter-Tier Cooling
See complete list of publications (18)
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Temiz, Yuksel
Temiz, Y
Temiz, Y.
Temiz, Y
Temiz, Y.
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