This project focused on optimization of the deposition of platinum (Pt) thin films or use in piezoelectric MEMS/NEMS devices. Theory of piezoelectric, DC and DC-pulsed sputtering and thin film characterization was studied. Two parameters were varied in the deposition of the Pt thin films: gas flow and applied target power. Residual stress, resistivity and thickness were characterized. Aluminum nitride (AlN) deposited on top of the Pt thin films was characterized in terms of residual stress and rocking curves through x-ray diffraction (XRD). Initial results showed that as applied target decreased, deposition rate of Pt decreased, while the influence of Ar gas flow was immediately understood. Results of AlN deposited on Pt showed an improved rocking curve for lower Pt sputtering power and gas flow.