Three-dimensional suspended integrated microstructure and method for making same
The invention concerns a method for making a suspended microstructure comprising the following steps: forming a masking layer on a substrate top surface; structuring the masking layer to form at least an opening substantially defining the surface of said microstructure and for exposing part of the substrate corresponding to said surface; causing by electrochemical process said exposed semiconductor material to become porous over a predetermined thickness; electropolishing the semiconductor material underlying said microstructure made porous to form a cavity enclosing at least partially said microstructure beneath the masking layer level; and releasing said microstructure made porous to form a microstructure suspended to said substrate by at least a connection portion of its perimeter to provide said microstructure with mobility outside the substrate plane.
8238961
Alternative title(s) : (de) Schwebende dreidimensionale mikrointegrierte struktur und herstellungsverfahren (fr) Microstructure integree suspendue tridimensionelle et procede de fabrication
TTO:6.0176
Patent number | Country code | Kind code | Date issued |
EP1263675 | EP | A1 | 2002-12-11 |
EP1088785 | EP | A1 | 2001-04-04 |
WO0119723 | WO | A1 | 2001-03-22 |