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  4. Effects of aging in dry environment on physical and mechanical properties of a cold-curing structural epoxy adhesive for bridge construction
 
research article

Effects of aging in dry environment on physical and mechanical properties of a cold-curing structural epoxy adhesive for bridge construction

Savvilotidou, M.  
•
Vassilopoulos, A. P.  
•
Frigione, M.
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2017
Construction and Building Materials

The effect of physical aging and continuation of curing on the physical and mechanical properties of a commercial cold-curing structural epoxy adhesive used in bridge construction has been investigated during the first year. Since adhesive bridge joints are sealed, only dry conditions were taken into account. Predominant physical aging in the earlier age and predominant curing in the later age affected the physical and mechanical properties. The E-modulus exhibited a maximum in the earlier age due to a maximum mass density caused by physical aging. In the later age, when curing became predominant, mass density and thus the E-modulus decreased while the cross-link density increased. After the first week, the E-modulus development became independent of the curing conditions. Tensile strength and failure strain depended mainly on the cross-link density and their development was thus influenced by the curing conditions but delayed in the earlier age due to physical aging. (C) 2017 Elsevier Ltd. All rights reserved.

  • Details
  • Metrics
Type
research article
DOI
10.1016/j.conbuildmat.2017.02.063
Web of Science ID

WOS:000398752200056

Author(s)
Savvilotidou, M.  
Vassilopoulos, A. P.  
Frigione, M.
Keller, T.  
Date Issued

2017

Publisher

Elsevier

Published in
Construction and Building Materials
Volume

140

Start page

552

End page

561

Subjects

Adhesive

•

Bridge construction

•

Cold-curing

•

Cross-link

•

Density

•

Epoxy

•

Physical aging

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
CCLAB  
Available on Infoscience
May 30, 2017
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/137864
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