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  4. Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance
 
research article

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Huang, Houxue  
•
Lamaison, Nicolas  
•
Thome, John R.  
2017
Journal Of Electronic Packaging

Multi-microchannel evaporators are often used to cool down electronic devices subjected to continuous heat load variations. However, so far, rare studies have addressed the transient flow boiling local heat transfer data occurring in such applications. The present paper introduces and compares two different data reduction methods for transient flow boiling data in a multi-microchannel evaporator. A transient test of heat disturbance from 20 to 30W cm(-2) was conducted in a multi-microchannel evaporator using R236fa as the test fluid. The test section was 1 x 1 cm(2) in size and had 67 channels, each having a cross-sectional area of 100 x 100 mu m(2). The micro-evaporator backside temperature was obtained with a fine-resolution infrared (IR) camera. The first data reduction method ( referred to three-dimensional (3D)-TDMA) consists in solving a transient 3D inverse heat conduction problem by using a tridiagonal matrix algorithm ( TDMA), a Newton-Raphson iteration, and a local energy balance method. The second method ( referred to two-dimensional (2D)controlled) considers only 2D conduction in the substrate of the micro-evaporator and solves at each time step the well-posed 2D conduction problem using a semi-implicit solver. It is shown that the first method is more accurate, while the second one reduces significantly the computational time but led to an approximated solution. This is mainly due to the 2D assumption used in the second method without considering heat conduction in the widthwise direction of the micro-evaporator.

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Type
research article
DOI
10.1115/1.4035386
Web of Science ID

WOS:000395123200007

Author(s)
Huang, Houxue  
Lamaison, Nicolas  
Thome, John R.  
Date Issued

2017

Publisher

Asme

Published in
Journal Of Electronic Packaging
Volume

139

Issue

1

Article Number

011005

Subjects

flow boiling local heat transfer

•

multi-microchannel evaporator

•

heat flux disturbance

•

transient data processing

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LTCM  
Available on Infoscience
May 1, 2017
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/136903
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