Estimation of the stress distribution in the solder or glue joint between a cantilever and its base, and of the corresponding bending stress distribution in the cantilever. This reports details results of modelling of the stresses in the solder or glue joints linking a cantilever to its base, using analytical and finite difference methods. The additional compliance due to joint deformation and its effect on the resonance frequency is also calculated. The parameters used in the examples are those of the MilliNewton force sensor (the three force ranges). Additionally, the effect of variations of joint length and joint elastic modulus (solder or glue) are studied and discussed. Also, the effect of introducing a yield stress for the joint material (valid especially for solder) is examined. Finally, the model is applied to previous solder strength studies and to the case of glass sealing.