Dissipateur thermique constitue d'un materiau composite diamant-cuivre renfermant du bore
A heat sink that is particularly suitable for semiconductor components is made from a diamond-containing composite material. In addition to a diamond fraction amounting to 40-90% by volume, the composite material also contains 7 to 59% by volume copper or a copper-rich phase (with Cu>80 at. %) and 0.01 to 20% by volume boron or a boron-rich phase (with B>50 at. %). The bonding of copper to the diamond grains can be considerably improved by the addition of boron, with the result that a high thermal conductivity can be achieved. The heat sink component is preferably produced with an unpressurized and pressure-assisted infiltration technique.
34140138
Alternative title(s) : (de) Wärmesenke aus borhaltigem diamant-kupfer-verbundwerkstoff (fr) Dissipateur thermique constitue d'un materiau composite diamant-cuivre renfermant du bore (en) Heat sink made from a diamond/copper composite material containing boron
TTO:6.0464
Patent number | Country code | Kind code | Date issued |
JP5275625 | JP | B2 | 2013-08-28 |
KR101161040 | KR | B1 | 2012-06-28 |
US7531020 | US | B2 | 2009-05-12 |
CN100472765 | CN | C | 2009-03-25 |
ES2306131 | ES | T3 | 2008-11-01 |
DE502005004531 | DE | D1 | 2008-08-07 |
AT399368 | AT | T | 2008-07-15 |
EP1741137 | EP | B1 | 2008-06-25 |
JP2007535151 | JP | A | 2007-11-29 |
CN1957467 | CN | A | 2007-05-02 |
US2007042895 | US | A1 | 2007-02-22 |
KR20070017185 | KR | A | 2007-02-08 |
EP1741137 | EP | A1 | 2007-01-10 |
WO2005106952 | WO | A1 | 2005-11-10 |
AT7522 | AT | U1 | 2005-04-25 |