Droplet-on-Demand Inkjet-filled TSVs as a Pathway to Cost-efficient Chip Stacking
2013
Details
Title
Droplet-on-Demand Inkjet-filled TSVs as a Pathway to Cost-efficient Chip Stacking
Author(s)
Sadie, Jacob ; Quack, Niels ; Wu, Ming C. ; Subramanian, Vivek
Conference
IMPAS 2013, 46th International Symposium on Microelectronics, Orlando, FL, USA, 30 September – 3 October, 2013
Date
2013
Laboratories
Q-LAB
Record Appears in
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > Q-LAB - Quack Group
Presentations & Talks
Work outside EPFL
Presentations & Talks
Work outside EPFL
Record creation date
2015-07-08