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conference presentation
Droplet-on-Demand Inkjet-filled TSVs as a Pathway to Cost-efficient Chip Stacking
2013
Type
conference presentation
Authors
Publication date
2013
EPFL units
Event name | Event place | Event date |
Orlando, FL, USA | 30 September – 3 October, 2013 | |
Available on Infoscience
July 8, 2015
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