Infoscience

Presentation / Talk

Droplet-on-Demand Inkjet-filled TSVs as a Pathway to Cost-efficient Chip Stacking

    Reference

    • EPFL-TALK-209892

    Record created on 2015-07-08, modified on 2016-08-09

Fulltext

  • There is no available fulltext. Please contact the lab or the authors.

Related material

Contacts

EPFL authors