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conference paper not in proceedings
Analysis of electromigration voiding phenomena in Cu interconnects
2006
Type
conference paper not in proceedings
Authors
Arnaud, L.
•
Guillaumond, J.F.
•
Claret, N.
•
•
Guedj, C.
•
Dupeux, M.
•
Arnal, V.
•
Reimbold, G.
•
Passemard, G.
•
Torres, J.
Publication date
2006
Peer reviewed
REVIEWED
EPFL units
Event name | Event date |
2006 | |
Available on Infoscience
November 14, 2014
Use this identifier to reference this record