Top-Down Fabrication of Gate-All-Around Vertically-Stacked Silicon Nanowire FETs with Controllable Polarity
Asthe currentMOSFET scaling trend is facing strong limitations, technologies exploiting novel degrees of freedom at physical and architecture level are promising candidates to enable the continuation of Moore's predictions. In this paper, we report on the fabrication of novel ambipolar Silicon nanowire (SiNW) Schottky-barrier (SB) FET transistors featuring two independent gate-all-around electrodes and vertically stacked SiNW channels. A top-down approach was employed for the nanowire fabrication, using an e-beam lithography defined design pattern. In these transistors, one gate electrode enables the dynamic configuration of the device polarity (n- or p-type) by electrostatic doping of the channel in proximity of the source and drain SBs. The other gate electrode, acting on the center region of the channel switches ON or OFF the device. Measurement results on silicon show I-on/I-off > 10(6) and subthreshold slopes approaching the thermal limit, SS approximate to 64 mV/dec (70 mV/dec) for p(n)-type operation in the same physical device. Finally, we show that the XOR logic operation is embedded in the device characteristic, and we demonstrate for the first time a fully functional two-transistor XOR gate.
Keywords: Ambipolar transistor ; Bosch process ; double-gate ; dual-gate ; e-beam lithography ; gate-all-around (GAA) ; polarity control ; silicon nanowire (SiNW) ; top-down fabrication ; XOR logic gate
Record created on 2014-10-03, modified on 2016-08-09