Conference paper

An interconnection method for ultra-compliant electrodes

We are developing a novel interconnection method to form reliable joints between truly stretchable electrode mounts and rigid substrates. This is needed as the electrodes must be connected to implanted electronics if they are to be used for long term implantation, and the components are most often mounted on a rigid substrate and protected within a solid enclosure. In this paper we describe the concept and report on preliminary results. Eight test samples were prepared, four of which started the underwater test. Their initial impedance ranged from 107 to 413 and remained constant (standard deviation 6) for over two months submersion.

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