Loading...
conference paper
3D serial TSV link for low-power chip-to-chip communication
2014
2014 IEEE International Conference on IC Design & Technology
Type
conference paper
Authors
Publication date
2014
Published in
2014 IEEE International Conference on IC Design & Technology
Peer reviewed
NON-REVIEWED
Event name | Event place | Event date |
Austin, Texas, USA | March 26, 2014 | |
Available on Infoscience
April 7, 2014
Use this identifier to reference this record